Chemical Name:N-(β-Aminoethyl)-γ-aminopropylmethyldimethoxysilane (HC-602 / KH-602)
CAS No.:3068-76-6
Product Categories:Organic Chemistry
Molecular Formula:C8H12N2O2Si
Formula Weight:135.26
Appearance:Colorless transparent liquid
Packaging Method:25KG/200L Plastic Drum
Type Of Transportation:By Air/By Sea/By Train/By Express
Sample:Available
Product Description Of
Appearance: Colorless to pale yellow transparent liquid
Density (25°C): 0.980–1.010 g/cm³
Refractive Index (25°C): 1.440–1.445
Boiling Point: Approximately 245 °C
Flash Point: ≥120 °C
Purity: ≥95%
Solubility: Soluble in alcohols, toluene, xylene and most organic solvents; hydrolyzable in water
Chemical Characteristics:
It contains secondary amine group and methoxy hydrolyzable group, as well as methyl hydrophobic group. It has moderate reactivity, lower volatility and milder reaction activity than KH-792. It can chemically bond with epoxy, phenolic, polyurethane resins and inorganic substrates such as glass, metal, silica and mineral powder.
Chemical Properties Of
Safety Information Of
Product Application Of
Adhesives and Sealants
Used as adhesion promoter for silicone sealant, MS modified silicone adhesive, epoxy and polyurethane adhesives. It improves bonding strength between resin and metal, glass, aluminum alloy and concrete, and enhances water resistance and aging resistance.
Glass Fiber Reinforced Composites
Used as glass fiber coupling agent and sizing agent to improve interfacial compatibility between glass fiber and resin matrix, enhance mechanical properties, hydrolysis resistance and electrical insulation of composite materials.
Inorganic Filler Surface Modification
Suitable for surface treatment of calcium carbonate, talc, mica, silica and clay. It improves the dispersion and lipophilicity of fillers in rubber and plastics, reduces system viscosity and enhances product toughness.
Coatings and Anti-corrosion Materials
Applied in industrial anti-corrosion coatings, primer and waterproof coatings. It improves substrate adhesion, salt spray resistance, weather resistance and film flexibility.
Rubber and Plastic Modified Materials
Used in halogen-free flame retardant plastics, engineering plastics and rubber products to improve the bonding between inorganic flame retardant/filler and polymer, and improve comprehensive mechanical performance.
Electronic Packaging Materials
Used for epoxy electronic potting glue and insulating packaging materials, improving moisture resistance, bonding performance and long-term stability of electronic components.
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