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Glycidyl ethoxymethyl diethoxysilane HC-563 CAS 2897-60-1
Chemical Name:Glycidyl ethoxymethyl diethoxysilane
CAS No.: 2897-60-1
Product Categories:Organic Chemistry
Purity:99%
Formula Weight:122.25
Appearance:Colorless transparent liquid
Packaging Method:25KG/200L Plastic Drum
Type Of Transportation:By Air/By Sea/By Train/By Express
Sample:Available
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Product Description Of
Glycidyl ethoxymethyl diethoxysilane HC-563 CAS 2897-60-1
- Easy to hydrolyze in humid environment to generate active silanol
- Epoxy group can react with amino, hydroxyl and carboxyl groups
- Soluble in alcohols, ketones and most organic solvents, slightly soluble in water
- Good low-temperature resistance and moderate thermal stability
- Excellent weather resistance, moisture resistance and corrosion resistance
- Good compatibility with epoxy resin, polyurethane and phenolic resin
- Low volatility, stable chemical property under sealed dark storage
- Excellent interfacial adhesion and surface modification activity
- Good flexibility after film forming, low internal stress
- Excellent insulation and water-proof performance
Chemical Properties Of
Glycidyl ethoxymethyl diethoxysilane HC-563 CAS 2897-60-1
Safety Information Of
Glycidyl ethoxymethyl diethoxysilane HC-563 CAS 2897-60-1
Product Application Of
Glycidyl ethoxymethyl diethoxysilane HC-563 CAS 2897-60-1
- Used as epoxy functional silane coupling agent for inorganic filler surface treatment.
- Improve bonding force between glass fiber, silica powder and organic resin matrix.
- Widely applied in epoxy adhesive, sealant and potting compound systems.
- Enhance adhesion, toughness and water resistance of coating materials.
- Ideal modifier for electronic insulating materials and encapsulating materials.
- Used for metal surface anti-corrosion, moisture-proof and priming treatment.
- Modify polyurethane and epoxy composite materials to optimize mechanical properties.
- Improve bonding performance of resin concrete and building reinforcement materials.
- Serve as adhesion promoter for water-based and solvent-based epoxy coatings.
- Applied in high-grade waterproof materials and outdoor weather-resistant composites.
- Optimize processing performance and reduce brittleness of filled plastic products.
- Used in new energy insulation components and precision electronic auxiliary materials.
Packaging Method Of
Glycidyl ethoxymethyl diethoxysilane HC-563 CAS 2897-60-1
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